W25Q32BVZPIG【PDF 4/78 页】IC SPI FLASH 32MBIT 8WSON

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W25Q32BV

7.2.37

7.2.38

7.2.39

Erase Security Registers (44h) ........................................................................................... 58

Program Security Registers (42h) ...................................................................................... 59

Read Security Registers (48h) ........................................................................................... 60

8.

ELECTRICAL CHARACTERISTICS .............................................................................................. 61

8.1

Absolute Maximum Ratings

(1)(2) ................................................................................... 61

8.2

8.3

8.4

8.5

8.6

8.7

8.8

8.9

8.10

8.11

Operating Ranges .............................................................................................................. 61

Power-Up Power-Down Timing and Requirements(1 ........................................................ 62

DC Electrical Characteristics .............................................................................................. 63

AC Measurement Conditions ............................................................................................. 64

AC Electrical Characteristics .............................................................................................. 65

AC Electrical Characteristics (cont’d) ................................................................................. 66

Serial Output Timing ........................................................................................................... 67

Serial Input Timing.............................................................................................................. 67

HOLD Timing ...................................................................................................................... 67

WP Timing .......................................................................................................................... 67

9.

PACKAGE SPECIFICATION .......................................................................................................... 68

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 68

8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 69

8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70

8-Pad WSON 6x5-mm (Package Code ZP) ....................................................................... 71

8-Pad WSON 8x6-mm (Package Code ZE) ....................................................................... 72

16-Pin SOIC 300-mil (Package Code SF).......................................................................... 73

24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 74

24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 75

10.

ORDERING INFORMATION .......................................................................................................... 76

10.1

Valid Part Numbers and Top Side Marking ........................................................................ 77

11.

REVISION HISTORY ...................................................................................................................... 78

-4-

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